Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8054630 | Electronic components on trenched substrates and method of forming same | David L. Questad, Jennifer V. Muney, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit | 2011-11-08 |
| 7901998 | Packaging substrate having pattern-matched metal layers | Sri M. Sri-Jayantha, Hien Dang, Arun Sharma | 2011-03-08 |
| 7896611 | Heat transfer device in a rotating structure | Gerard McVicker, Sri M. Sri-Jayantha | 2011-03-01 |