Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8085550 | Implementing enhanced solder joint robustness for SMT pad structure | Mark K. Hoffmeyer, Steven P. Ostrander | 2011-12-27 |
| 8056027 | Characterizing thermomechanical properties of an organic substrate using three-dimensional finite element analysis | Hien Dang, Vijaveshwar Das Khanna, Arun Sharma | 2011-11-08 |
| 8054630 | Electronic components on trenched substrates and method of forming same | David L. Questad, Vijayeshwar D. Khanna, Jennifer V. Muney, Arun Sharma, Lorenzo Valdevit | 2011-11-08 |
| 8047421 | Elliptic C4 with optimal orientation for enhanced reliability in electronic packages | Lorenzo Valdevit | 2011-11-01 |
| 7964444 | Method and apparatus for manufacturing electronic integrated circuit chip | — | 2011-06-21 |
| 7928548 | Silicon heat spreader mounted in-plane with a heat source and method therefor | Kerry Bernstein | 2011-04-19 |
| 7904185 | System and method for sensor replication for ensemble averaging in micro-electromechanical system (MEMS) | Arun Sharma, Hien Dang, Evangelos S. Eleftheriou, Mark A. Lantz, Charalampos Pozidis | 2011-03-08 |
| 7901998 | Packaging substrate having pattern-matched metal layers | Hien Dang, Vijayeshwar D. Khanna, Arun Sharma | 2011-03-08 |
| 7896611 | Heat transfer device in a rotating structure | Vijayeshwar D. Khanna, Gerard McVicker | 2011-03-01 |