Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8085550 | Implementing enhanced solder joint robustness for SMT pad structure | Steven P. Ostrander, Sri M. Sri-Jayantha | 2011-12-27 |
| 7985095 | Implementing enhanced connector guide block structures for robust SMT assembly | William L. Brodsky, John L. Colbert | 2011-07-26 |
| 7944698 | Mounting a heat sink in thermal contact with an electronic component | John L. Colbert, Eric A. Eckberg, Roger Duane Hamilton, Amanda E. Mikhail, Arvind K. Sinha | 2011-05-17 |