Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8085550 | Implementing enhanced solder joint robustness for SMT pad structure | Mark K. Hoffmeyer, Sri M. Sri-Jayantha | 2011-12-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8085550 | Implementing enhanced solder joint robustness for SMT pad structure | Mark K. Hoffmeyer, Sri M. Sri-Jayantha | 2011-12-27 |