Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8056027 | Characterizing thermomechanical properties of an organic substrate using three-dimensional finite element analysis | Vijaveshwar Das Khanna, Arun Sharma, Sri M. Sri-Jayantha | 2011-11-08 |
| 7901998 | Packaging substrate having pattern-matched metal layers | Sri M. Sri-Jayantha, Vijayeshwar D. Khanna, Arun Sharma | 2011-03-08 |
| 7904185 | System and method for sensor replication for ensemble averaging in micro-electromechanical system (MEMS) | Sri M. Sri-Jayantha, Arun Sharma, Evangelos S. Eleftheriou, Mark A. Lantz, Charalampos Pozidis | 2011-03-08 |