Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7982475 | Structure and method for reliability evaluation of FCPBGA substrates for high power semiconductor packaging applications | Ronald Malfatt, Stefano S. Oggioni, Jamil A. Wakil | 2011-07-19 |
| 7868459 | Semiconductor package having non-aligned active vias | Jean Audet, Luc Guerin, David L. Questad | 2011-01-11 |