Issued Patents 2011
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8040813 | Apparatus and method for reduced loading of signal transmission elements | Karl D. Selander, Michael A. Sorna, Daniel W. Storaska | 2011-10-18 |
| 8030113 | Thermoelectric 3D cooling | Ping-Chuan Wang, Xiaojin Wei, Huilong Zhu | 2011-10-04 |
| 8023305 | High density planar magnetic domain wall memory apparatus | Michael C. Gaidis, Lawrence A. Clevenger, Timothy J. Dalton, John K. DeBrosse, Carl Radens +2 more | 2011-09-20 |
| 8024679 | Structure for apparatus for reduced loading of signal transmission elements | Karl D. Selander, Michael A. Sorna, Daniel W. Storaska | 2011-09-20 |
| 8024012 | Intelligent wireless power charging system | Lawrence A. Clevenger, Timothy J. Dalton, Carl Radens | 2011-09-20 |
| 8009453 | High density planar magnetic domain wall memory apparatus | Michael C. Gaidis, Lawrence A. Clevenger, Timothy J. Dalton, John K. DeBrosse, Carl Radens +2 more | 2011-08-30 |
| 8004097 | Carrier wafer having alignment keys and supporting a chip | Howard H. Chen | 2011-08-23 |
| 7994042 | Techniques for impeding reverse engineering | Rajiv V. Joshi, David W. Kruger | 2011-08-09 |
| 7984409 | Structures incorporating interconnect structures with improved electromigration resistance | Jack A. Mandelman, William R. Tonti, Chih-Chao Yang | 2011-07-19 |
| 7984408 | Structures incorporating semiconductor device structures with reduced junction capacitance and drain induced barrier lowering | Kangguo Cheng, Jack A. Mandelman, Haining Yang | 2011-07-19 |
| 7968949 | Contact forming method and related semiconductor device | Daniel C. Edelstein, Chih-Chao Yang | 2011-06-28 |
| 7956466 | Structure for interconnect structure containing various capping materials for electrical fuse and other related applications | William R. Tonti, Chih-Chao Yang | 2011-06-07 |
| 7948084 | Dielectric material with a reduced dielectric constant and methods of manufacturing the same | Jack A. Mandelman, Chih-Chao Yang | 2011-05-24 |
| 7947566 | Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate | Howard H. Chen, Jack A. Mandelman | 2011-05-24 |
| 7930664 | Programmable through silicon via | Kai D. Feng, Ping-Chuan Wang, Zhijian Yang | 2011-04-19 |
| 7923712 | Phase change memory element with a peripheral connection to a thin film electrode | John C. Arnold, Lawrence A. Clevenger, Timothy J. Dalton, Michael C. Gaidis, Carl Radens +2 more | 2011-04-12 |
| 7915682 | Semiconductor FinFET structures with encapsulated gate electrodes and methods for forming such semiconductor FinFET structures | Jack A. Mandelman | 2011-03-29 |
| 7911263 | Leakage current mitigation in a semiconductor device | Jong-Ru Guo, Rajiv V. Joshi, Ping-Chuan Wang, Zhijian Yang | 2011-03-22 |
| 7898014 | Semiconductor device structures with self-aligned doped regions and methods for forming such semiconductor device structures | Kangguo Cheng, Jack A. Mandelman | 2011-03-01 |
| 7893529 | Thermoelectric 3D cooling | Ping-Chuan Wang, Xiaojin Wei, Huilong Zhu | 2011-02-22 |
| 7888729 | Flash memory gate structure for widened lithography window | Kangguo Cheng, Lawrence A. Clevenger, Timothy J. Dalton | 2011-02-15 |
| 7875960 | Hybrid oriented substrates and crystal imprinting methods for forming such hybrid oriented substrates | Jack A. Mandelman, William R. Tonti | 2011-01-25 |
| 7873922 | Structure for robust cable connectivity test receiver for high-speed data receiver | Huihao Xu, Kevin G. Kramer, James D. Rockrohr, Michael A. Sorna | 2011-01-18 |
| 7867820 | Methods for forming co-planar wafer-scale chip packages | Lloyd Burrell, Howard H. Chen, Wolfgang Sauter | 2011-01-11 |
| 7868374 | Semitubular metal-oxide-semiconductor field effect transistor | Kangguo Cheng, Lawrence A. Clevenger, Timothy J. Dalton, Jack A. Mandelman | 2011-01-11 |