Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8086988 | Chip design and fabrication method optimized for profit | Nathan C. Buck, James Eckhardt, Eric A. Foreman, James C. Gregerson, Peter A. Habitz +3 more | 2011-12-27 |
| 8076190 | Sea-of-fins structure on a semiconductor substrate and method of fabrication | Louis C. Hsu, Jack A. Mandelman, Chun-Yung Sung | 2011-12-13 |
| 8004097 | Carrier wafer having alignment keys and supporting a chip | Louis L. Hsu | 2011-08-23 |
| 7947566 | Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate | Louis L. Hsu, Jack A. Mandelman | 2011-05-24 |
| 7947599 | Laser annealing for 3-D chip integration | Louis C. Hsu, Lawrence S. Mok, J. Campbell Scott | 2011-05-24 |
| 7867820 | Methods for forming co-planar wafer-scale chip packages | Lloyd Burrell, Louis L. Hsu, Wolfgang Sauter | 2011-01-11 |