Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7867820 | Methods for forming co-planar wafer-scale chip packages | Howard H. Chen, Louis L. Hsu, Wolfgang Sauter | 2011-01-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7867820 | Methods for forming co-planar wafer-scale chip packages | Howard H. Chen, Louis L. Hsu, Wolfgang Sauter | 2011-01-11 |