CM

Christopher D. Muzzy

IBM: 12 patents #150 of 9,568Top 2%
📍 Burlington, VT: #4 of 41 inventorsTop 10%
🗺 Vermont: #24 of 615 inventorsTop 4%
Overall (2011): #2,429 of 364,097Top 1%
12
Patents 2011

Issued Patents 2011

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
7989358 Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch Timothy H. Daubenspeck, Jeffrey P. Gambino, Jerome B. Lasky, Wolfgang Sauter 2011-08-02
7985671 Structures and methods for improving solder bump connections in semiconductor devices Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan 2011-07-26
7981732 Programming of laser fuse Dinesh A. Badami, Tom C. Lee, Baozhen Li, Gerald Matusiewicz, William T. Motsiff +2 more 2011-07-19
7958477 Structure, failure analysis tool and method of determining white bump location using failure analysis tool Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Jeffrey S. Zimmerman 2011-06-07
7939390 Gap capacitors for monitoring stress in solder balls in flip chip technology Stephen P. Ayotte, Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2011-05-10
7935408 Substrate anchor structure and method Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2011-05-03
7911803 Current distribution structure and method Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2011-03-22
7910408 Damage propagation barrier and method of forming Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2011-03-22
7871920 Semiconductor chips with reduced stress from underfill at edge of chip Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2011-01-18
7871919 Structures and methods for improving solder bump connections in semiconductor devices Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan 2011-01-18
7862987 Method for forming an electrical structure comprising multiple photosensitive materials Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter 2011-01-04
7863734 Dual-sided chip attached modules Kerry Bernstein, Timothy J. Dalton, Timothy H. Daubenspeck, Jeffrey P. Gambino, Mark D. Jaffe +3 more 2011-01-04