Issued Patents 2011
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7923840 | Electrically conductive path forming below barrier oxide layer and integrated circuit | Gregory Costrini, Ramachandra Divakaruni, Randy W. Mann | 2011-04-12 |
| 7915162 | Method of forming damascene filament wires | Brent A. Anderson, Andres Bryant, Anthony K. Stamper | 2011-03-29 |
| 7911803 | Current distribution structure and method | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2011-03-22 |
| 7910408 | Damage propagation barrier and method of forming | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2011-03-22 |
| 7892940 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2011-02-22 |
| 7893468 | Optical sensor including stacked photodiodes | Daniel N. Maynard, Kevin N. Ogg, Richard J. Rassel, Raymond J. Rosner | 2011-02-22 |
| 7892926 | Fuse link structures using film stress for programming and methods of manufacture | Karl W. Barth, Tom C. Lee, Kevin S. Petrarca | 2011-02-22 |
| 7884475 | Conductor structure including manganese oxide capping layer | Stephen E. Luce | 2011-02-08 |
| 7886240 | Modifying layout of IC based on function of interconnect and related circuit and design structure | James W. Adkisson, Natalie B. Feilchenfeld, Howard S. Landis, Benjamin T. Voegeli, Steven H. Voldman +1 more | 2011-02-08 |
| 7883916 | Optical sensor including stacked photosensitive diodes | Daniel N. Maynard, Kevin N. Ogg, Richard J. Rassel, Raymond J. Rosner | 2011-02-08 |
| 7871919 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2011-01-18 |
| 7871920 | Semiconductor chips with reduced stress from underfill at edge of chip | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2011-01-18 |
| 7867897 | Low leakage metal-containing cap process using oxidation | Jason P. Gill, Sean Smith, Jean Wynne | 2011-01-11 |
| 7863734 | Dual-sided chip attached modules | Kerry Bernstein, Timothy J. Dalton, Timothy H. Daubenspeck, Mark D. Jaffe, Christopher D. Muzzy +3 more | 2011-01-04 |
| 7862987 | Method for forming an electrical structure comprising multiple photosensitive materials | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2011-01-04 |