Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7919356 | Method and structure to reduce cracking in flip chip underfill | Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2011-04-05 |
| 7867887 | Structure and method for enhancing resistance to fracture of bonding pads | Ian D. Melville, Mukta G. Farooq | 2011-01-11 |