GB

Griselda Bonilla

IBM: 3 patents #1,237 of 9,568Top 15%
CM Chartered Semiconductor Manufacturing: 1 patents #24 of 106Top 25%
Samsung: 1 patents #3,826 of 8,673Top 45%
📍 Hopewell Junction, NY: #22 of 104 inventorsTop 25%
🗺 New York: #1,093 of 10,473 inventorsTop 15%
Overall (2011): #48,733 of 364,097Top 15%
3
Patents 2011

Issued Patents 2011

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
8026166 Interconnect structures comprising capping layers with low dielectric constants and methods of making the same Tien-Jen Cheng, Lawrence A. Clevenger, Stephan Grunow, Chao-Kun Hu, Roger A. Quon +5 more 2011-09-27
8003520 Air gap structure having protective metal silicide pads on a metal feature Daniel C. Edelstein, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth, David L. Rath +1 more 2011-08-23
7884477 Air gap structure having protective metal silicide pads on a metal feature Daniel C. Edelstein, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth, David L. Rath +1 more 2011-02-08