Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017522 | Mechanically robust metal/low-κ interconnects | Qinghuang Lin, Darshan Gandhi, Christy S. Tyberg | 2011-09-13 |
| 8003524 | Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement | Chih-Chao Yang, Simon Gaudet, Christian Lavoie, Shom Ponoth | 2011-08-23 |