DE

Daniel C. Edelstein

IBM: 12 patents #46 of 5,400Top 1%
📍 White Plains, NY: #1 of 52 inventorsTop 2%
🗺 New York: #44 of 9,277 inventorsTop 1%
Overall (2002): #1,135 of 266,432Top 1%
12
Patents 2002

Issued Patents 2002

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
6498385 Post-fuse blow corrosion prevention structure for copper fuses Timothy H. Daubenspeck, Robert M. Geffken, William T. Motsiff, Anthony K. Stamper, Steven H. Voldman 2002-12-24
6492259 Process for making a planar integrated circuit interconnect Bachir Dirahoui, Robert C. Greenlese, Harris C. Jones 2002-12-10
6486557 Hybrid dielectric structure for improving the stiffness of back end of the line structures Charles R. Davis, John C. Hay, Jr., Jeffrey Hedrick, Christopher V. Jahnes, Vincent J. McGahay +1 more 2002-11-26
6465376 Method and structure for improving electromigration of chip interconnects Cyprian Emeka Uzoh, Andrew H. Simon 2002-10-15
6457234 Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond Judith M. Rubino, Carlos J. Sambucetti, Anthony K. Stamper 2002-10-01
6437440 Thin film metal barrier for electrical interconnections Cyril Cabral, Jr., Patrick W. DeHaven, David P. Klaus, James Manley Pollard, III, Carol L. Stanis +1 more 2002-08-20
6413854 Method to build multi level structure Cyprian Emeka Uzoh, Cheryl G. Faltermeier, Peter S. Locke 2002-07-02
6399496 Copper interconnection structure incorporating a metal seed layer James M. E. Harper, Chao-Kun Hu, Andrew H. Simon, Cyprian Emeka Uzoh 2002-06-04
6375693 Chemical-mechanical planarization of barriers or liners for copper metallurgy William J. Cote, Naftali E. Lustig 2002-04-23
6358832 Method of forming barrier layers for damascene interconnects Timothy J. Dalton, John G. Gaudiello, Mahadevaiyer Krishnan, Sandra G. Malhotra, Maurice McGlashan-Powell +2 more 2002-03-19
6337151 Graded composition diffusion barriers for chip wiring applications Cyprian Emeka Uzoh, Andrew H. Simon 2002-01-08
6335104 Method for preparing a conductive pad for electrical connection and conductive pad formed Carlos J. Sambucetti, John G. Gaudiello, Judith M. Rubino, George F. Walker 2002-01-01