Issued Patents 2002
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498385 | Post-fuse blow corrosion prevention structure for copper fuses | Timothy H. Daubenspeck, Daniel C. Edelstein, Robert M. Geffken, William T. Motsiff, Steven H. Voldman | 2002-12-24 |
| 6495917 | Method and structure of column interconnect | John J. Ellis-Monaghan, Paul M. Feeney, Robert M. Geffken, Howard S. Landis, Rosemary A. Previti-Kelly +3 more | 2002-12-17 |
| 6489663 | Spiral inductor semiconducting device with grounding strips and conducting vias | Arne Ballantine, Robert A. Groves, Michael B. Rice | 2002-12-03 |
| 6457234 | Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond | Daniel C. Edelstein, Judith M. Rubino, Carlos J. Sambucetti | 2002-10-01 |
| 6452779 | One-mask metal-insulator-metal capacitor and method for forming same | Eric Adler | 2002-09-17 |
| 6452251 | Damascene metal capacitor | Kerry Bernstein, Robert M. Geffken, Stephen A. St. Onge | 2002-09-17 |
| 6444557 | Method of forming a damascene structure using a sacrificial conductive layer | Peter Biolsi, Gregory S. Jankowski, Laurie M. Krywanczyk | 2002-09-03 |
| 6436814 | Interconnection structure and method for fabricating same | David V. Horak, William A. Klaasen, Thomas L. McDevitt, Mark P. Murray | 2002-08-20 |
| 6433429 | Copper conductive line with redundant liner and method of making | — | 2002-08-13 |
| 6429524 | Ultra-thin tantalum nitride copper interconnect barrier | Edward C. Cooney, III | 2002-08-06 |
| 6426249 | Buried metal dual damascene plate capacitor | Robert M. Geffken | 2002-07-30 |
| 6426558 | Metallurgy for semiconductor devices | Jonathan D. Chapple-Sokol, Paul M. Feeney, Robert M. Geffken, David V. Horak, Mark P. Murray | 2002-07-30 |
| 6420254 | Recessed bond pad | Sally J. Yankee | 2002-07-16 |
| 6403393 | Device having integrated optical and copper conductors and method of fabricating same | James W. Adkisson, Paul W. Pastel | 2002-06-11 |
| 6384468 | Capacitor and method for forming same | Kerry Bernstein, Nicholas Theodore Schmidt, Stephen A. St. Onge, Steven H. Voldman | 2002-05-07 |
| 6368903 | SOI low capacitance body contact | Andres Bryant, Randy W. Mann | 2002-04-09 |
| 6362531 | Recessed bond pad | Sally J. Yankee | 2002-03-26 |
| 6342733 | Reduced electromigration and stressed induced migration of Cu wires by surface coating | Chao-Kun Hu, Robert Rosenberg, Judith M. Rubino, Carlos J. Sambucetti | 2002-01-29 |
| 6339022 | Method of annealing copper metallurgy | Arne Ballantine, Edward C. Cooney, III, George A. Dunbar, III, Cheryl G. Faltermeier, Jeffrey D. Gilbert +9 more | 2002-01-15 |