Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448173 | Aluminum-based metallization exhibiting reduced electromigration and method therefor | Lawrence A. Clevenger, Ronald G. Filippi, Kenneth P. Rodbell, Roy Iggulden, Lynne M. Gignac +3 more | 2002-09-10 |
| 6399496 | Copper interconnection structure incorporating a metal seed layer | Daniel C. Edelstein, James M. E. Harper, Andrew H. Simon, Cyprian Emeka Uzoh | 2002-06-04 |
| 6380075 | Method for forming an open-bottom liner for a conductor in an electronic structure and device formed | Cyril Cabral, Jr., Sandra G. Malhotra, Fenton R. McFeely, Stephen M. Rossnagel, Andrew H. Simon | 2002-04-30 |
| 6342733 | Reduced electromigration and stressed induced migration of Cu wires by surface coating | Robert Rosenberg, Judith M. Rubino, Carlos J. Sambucetti, Anthony K. Stamper | 2002-01-29 |