Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465376 | Method and structure for improving electromigration of chip interconnects | Cyprian Emeka Uzoh, Daniel C. Edelstein | 2002-10-15 |
| 6399496 | Copper interconnection structure incorporating a metal seed layer | Daniel C. Edelstein, James M. E. Harper, Chao-Kun Hu, Cyprian Emeka Uzoh | 2002-06-04 |
| 6380075 | Method for forming an open-bottom liner for a conductor in an electronic structure and device formed | Cyril Cabral, Jr., Chao-Kun Hu, Sandra G. Malhotra, Fenton R. McFeely, Stephen M. Rossnagel | 2002-04-30 |
| 6380628 | Microstructure liner having improved adhesion | John A. Miller, Jill Slattery, Cyprian Emeka Uzoh, Yun-Yu Wang | 2002-04-30 |
| 6339022 | Method of annealing copper metallurgy | Arne Ballantine, Edward C. Cooney, III, George A. Dunbar, III, Cheryl G. Faltermeier, Jeffrey D. Gilbert +9 more | 2002-01-15 |
| 6337151 | Graded composition diffusion barriers for chip wiring applications | Cyprian Emeka Uzoh, Daniel C. Edelstein | 2002-01-08 |