Issued Patents 2002
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448131 | Method for increasing the capacitance of a trench capacitor | Kevin K. Chan, Guy M. Cohen, Ramachandra Divakaruni, Christian Lavoie, Fenton R. McFeely | 2002-09-10 |
| 6444578 | Self-aligned silicide process for reduction of Si consumption in shallow junction and thin SOI electronic devices | Roy A. Carruthers, Kevin K. Chan, Guy M. Cohen, Kathryn Guarini, James M. E. Harper +2 more | 2002-09-03 |
| 6440851 | Method and structure for controlling the interface roughness of cobalt disilicide | Paul D. Agnello, Roy A. Carruthers, James M. E. Harper, Christian Lavoie, Kirk D. Peterson +4 more | 2002-08-27 |
| 6436823 | Method for forming a TiN layer on top of a metal silicide layer in a semiconductor structure and structure formed | Chung-Ping Eng, Lynne M. Gignac, Christian Lavoie, Patricia A. O'Neil, Kirk D. Peterson +3 more | 2002-08-20 |
| 6437440 | Thin film metal barrier for electrical interconnections | Patrick W. DeHaven, Daniel C. Edelstein, David P. Klaus, James Manley Pollard, III, Carol L. Stanis +1 more | 2002-08-20 |
| 6429523 | Method for forming interconnects on semiconductor substrates and structures formed | Panayotis Andricacos, John M. Cotte, Lynne M. Gignac, Wilma Jean Horkans, Kenneth P. Rodbell | 2002-08-06 |
| 6413859 | Method and structure for retarding high temperature agglomeration of silicides using alloys | Roy A. Carruthers, James M. E. Harper, Paul Kozlowski, Christian Lavoie, Joseph S. Newbury +1 more | 2002-07-02 |
| 6391773 | Method and materials for through-mask electroplating and selective base removal | Panayotis Andricacos, Roy A. Carruthers, Alfred Grill, Katherine L. Saenger | 2002-05-21 |
| 6388327 | Capping layer for improved silicide formation in narrow semiconductor structures | Kenneth J. Giewont, Stephen Bruce Brodsky, Anthony G. Domenicucci, Craig Ransom, Yun-Yu Wang +2 more | 2002-05-14 |
| 6388285 | Feram cell with internal oxygen source and method of oxygen release | Charles T. Black, Alfred Grill, Deborah A. Neumayer, Wilbur D. Pricer, Katherine L. Saenger +1 more | 2002-05-14 |
| 6380075 | Method for forming an open-bottom liner for a conductor in an electronic structure and device formed | Chao-Kun Hu, Sandra G. Malhotra, Fenton R. McFeely, Stephen M. Rossnagel, Andrew H. Simon | 2002-04-30 |
| 6344129 | Method for plating copper conductors and devices formed | Kenneth P. Rodbell, Panayotis Andricacos, Lynne M. Gignac, Cyprian Emeka Uzoh, Peter S. Locke | 2002-02-05 |