Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448173 | Aluminum-based metallization exhibiting reduced electromigration and method therefor | Lawrence A. Clevenger, Ronald G. Filippi, Kenneth P. Rodbell, Roy Iggulden, Chao-Kun Hu +3 more | 2002-09-10 |
| 6436823 | Method for forming a TiN layer on top of a metal silicide layer in a semiconductor structure and structure formed | Cyril Cabral, Jr., Chung-Ping Eng, Christian Lavoie, Patricia A. O'Neil, Kirk D. Peterson +3 more | 2002-08-20 |
| 6429523 | Method for forming interconnects on semiconductor substrates and structures formed | Panayotis Andricacos, Cyril Cabral, Jr., John M. Cotte, Wilma Jean Horkans, Kenneth P. Rodbell | 2002-08-06 |
| 6417567 | Flat interface for a metal-silicon contract barrier film | Anthony G. Domenicucci, Yun-Yu Wang, Horatio S. Wildman, Kwong Hon Wong, Roy A. Carruthers +2 more | 2002-07-09 |
| 6344129 | Method for plating copper conductors and devices formed | Kenneth P. Rodbell, Panayotis Andricacos, Cyril Cabral, Jr., Cyprian Emeka Uzoh, Peter S. Locke | 2002-02-05 |