Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6471845 | Method of controlling chemical bath composition in a manufacturing environment | John O. Dukovic, William E. Corbin, Jr., Erick G. Walton, Peter S. Locke, James E. Fluegel +2 more | 2002-10-29 |
| 6429523 | Method for forming interconnects on semiconductor substrates and structures formed | Cyril Cabral, Jr., John M. Cotte, Lynne M. Gignac, Wilma Jean Horkans, Kenneth P. Rodbell | 2002-08-06 |
| 6416812 | Method for depositing copper onto a barrier layer | Steven H. Boettcher, Fenton R. McFeely, Milan Paunovic | 2002-07-09 |
| 6406608 | Apparatus to monitor and add plating solution to plating baths and controlling quality of deposited metal | Cyprian Emeka Uzoh, Wilma Jean Horkans | 2002-06-18 |
| 6395164 | Copper seed layer repair technique using electroless touch-up | James E. Fluegel, John G. Gaudiello, Ronald D. Goldblatt, Sandra G. Malhotra, Milan Paunovic | 2002-05-28 |
| 6391773 | Method and materials for through-mask electroplating and selective base removal | Cyril Cabral, Jr., Roy A. Carruthers, Alfred Grill, Katherine L. Saenger | 2002-05-21 |
| 6344129 | Method for plating copper conductors and devices formed | Kenneth P. Rodbell, Cyril Cabral, Jr., Lynne M. Gignac, Cyprian Emeka Uzoh, Peter S. Locke | 2002-02-05 |