RG

Ronald D. Goldblatt

IBM: 2 patents #982 of 5,400Top 20%
📍 Yorktown Heights, NY: #32 of 141 inventorsTop 25%
🗺 New York: #1,481 of 9,277 inventorsTop 20%
Overall (2002): #44,481 of 266,432Top 20%
2
Patents 2002

Issued Patents 2002

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6395164 Copper seed layer repair technique using electroless touch-up Panayotis Andricacos, James E. Fluegel, John G. Gaudiello, Sandra G. Malhotra, Milan Paunovic 2002-05-28
6339022 Method of annealing copper metallurgy Arne Ballantine, Edward C. Cooney, III, George A. Dunbar, III, Cheryl G. Faltermeier, Jeffrey D. Gilbert +9 more 2002-01-15