Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6395164 | Copper seed layer repair technique using electroless touch-up | Panayotis Andricacos, James E. Fluegel, Ronald D. Goldblatt, Sandra G. Malhotra, Milan Paunovic | 2002-05-28 |
| 6383617 | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby | Gerald L. Ballard, Robert D. Edwards, Voya R. Markovich | 2002-05-07 |
| 6358832 | Method of forming barrier layers for damascene interconnects | Daniel C. Edelstein, Timothy J. Dalton, Mahadevaiyer Krishnan, Sandra G. Malhotra, Maurice McGlashan-Powell +2 more | 2002-03-19 |
| 6335104 | Method for preparing a conductive pad for electrical connection and conductive pad formed | Carlos J. Sambucetti, Daniel C. Edelstein, Judith M. Rubino, George F. Walker | 2002-01-01 |