Issued Patents 2002
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495239 | Dielectric structure and method of formation | Anilkumar C. Bhatt, Stephen Joseph Fuerniss, Roy H. Magnuson | 2002-12-17 |
| 6495772 | High performance dense wire for printed circuit board | Donald O. Anstrom, Bruce J. Chamberlin, John M. Lauffer, David L. Thomas | 2002-12-17 |
| 6492715 | Integrated semiconductor package | Douglas O. Powell, Amit K. Sarkhel | 2002-12-10 |
| 6492600 | Laminate having plated microvia interconnects and method for forming the same | Miguel A. Jimarez, Ross W. Keesler, Rajinder S. Rai, Cheryl L. Tytran-Palomaki | 2002-12-10 |
| 6486415 | Compliant layer for encapsulated columns | Lisa J. Jimarez, Miguel A. Jimarez, Cynthia S. Milkovich, Charles H. Perry, Brenda Peterson | 2002-11-26 |
| 6479093 | Composite laminate circuit structure and methods of interconnecting the same | John M. Lauffer, Thomas R. Miller, Konstantinos I. Papathomas, William E. Wilson | 2002-11-12 |
| 6459047 | Laminate circuit structure and method of fabricating | Robert M. Japp, Konstantinos I. Papathomas | 2002-10-01 |
| 6451509 | Composite laminate circuit structure and method of forming the same | Ross W. Keesler, Jim P. Paoletti, Marybeth Perrino, William E. Wilson | 2002-09-17 |
| RE37840 | Method of preparing a printed circuit board | Anilkumar C. Bhatt, Roy H. Magnuson, Konstantinos I. Papathomas, Douglas O. Powell | 2002-09-17 |
| 6436803 | Manufacturing computer systems with fine line circuitized substrates | Anilkumar C. Bhatt, Roy H. Magnuson, Thomas R. Miller, Carlos J. Sambucetti, Stephen L. Tisdale | 2002-08-20 |
| 6418616 | Full additive process with filled plated through holes | Anilkumar C. Bhatt, Irving Memis, William E. Wilson | 2002-07-16 |
| 6414509 | Method and apparatus for in-situ testing of integrated circuit chips | Anilkumar C. Bhatt, Leo Raymond Buda, Robert D. Edwards, Paul Joseph Hart, Anthony P. Ingraham +6 more | 2002-07-02 |
| 6407341 | Conductive substructures of a multilayered laminate | Donald O. Anstrom, Bruce J. Chamberlin, James W. Fuller, John M. Lauffer, Douglas O. Powell +2 more | 2002-06-18 |
| 6391210 | Process for manufacturing a multi-layer circuit board | Bernd Karl Appelt, John M. Lauffer, Irving Memis, David J. Russell | 2002-05-21 |
| 6388204 | Composite laminate circuit structure and methods of interconnecting the same | John M. Lauffer, Thomas R. Miller, Konstantinos I. Papathomas, William E. Wilson | 2002-05-14 |
| 6383617 | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby | Gerald L. Ballard, Robert D. Edwards, John G. Gaudiello | 2002-05-07 |
| 6370012 | Capacitor laminate for use in printed circuit board and as an interconnector | Sylvia Adae-Amoakoh, John M. Lauffer, Michael D. Lowell, Joseph J. Sniezek | 2002-04-09 |