Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486415 | Compliant layer for encapsulated columns | Lisa J. Jimarez, Miguel A. Jimarez, Voya R. Markovich, Cynthia S. Milkovich, Charles H. Perry | 2002-11-26 |
| 6475555 | Process for screening features on an electronic substrate with a low viscosity paste | Jon A. Casey, Dinesh Gupta, Lester W. Herron, John U. Knickerbocker, David C. Long +2 more | 2002-11-05 |
| 6458623 | Conductive adhesive interconnection with insulating polymer carrier | Lewis S. Goldmann, Mario J. Interrante, Raymond A. Jackson, Amy B. Ostrander, Charles H. Perry | 2002-10-01 |
| 6429388 | High density column grid array connections and method thereof | Mario J. Interrante, Sudipta K. Ray, William E. Sablinski, Amit K. Sarkhel | 2002-08-06 |
| 6402866 | Powdered metallic sheet method for deposition of substrate conductors | Jon A. Casey, John U. Knickerbocker, David C. Long | 2002-06-11 |
| 6341417 | Pre-patterned substrate layers for being personalized as needed | Dinesh Gupta, Lester W. Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak +1 more | 2002-01-29 |