LG

Lewis S. Goldmann

IBM: 4 patents #358 of 5,400Top 7%
📍 Bedford, NY: #2 of 10 inventorsTop 20%
🗺 New York: #534 of 9,277 inventorsTop 6%
Overall (2002): #14,190 of 266,432Top 6%
4
Patents 2002

Issued Patents 2002

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6462271 Capping structure for electronics package undergoing compressive socket actuation Jeffrey T. Coffin, Michael J. Ellsworth, Jr., John G. Torok 2002-10-08
6458623 Conductive adhesive interconnection with insulating polymer carrier Mario J. Interrante, Raymond A. Jackson, Amy B. Ostrander, Charles H. Perry, Brenda Peterson 2002-10-01
6459160 Package with low stress hermetic seal Eric D. Perfecto, Raed A. Sherif, William F. Shutler, Hilton T. Toy 2002-10-01
6342407 Low stress hermetic seal Eric D. Perfecto, Raed A. Sherif, William F. Shutler, Hilton T. Toy 2002-01-29