Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6469375 | High bandwidth 3D memory packaging technique | William F. Beausoleil, Edmund Blackshear, Michael J. Ellsworth, Jr., Norton J. Tomassetti | 2002-10-22 |
| 6459160 | Package with low stress hermetic seal | Lewis S. Goldmann, Eric D. Perfecto, Raed A. Sherif, Hilton T. Toy | 2002-10-01 |
| 6442041 | MCM—MLC technology | Simone Rehm, Bernd Garden, Erich Klink, Gisbert Thomke | 2002-08-27 |
| 6342407 | Low stress hermetic seal | Lewis S. Goldmann, Eric D. Perfecto, Raed A. Sherif, Hilton T. Toy | 2002-01-29 |