Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6469375 | High bandwidth 3D memory packaging technique | William F. Beausoleil, Michael J. Ellsworth, Jr., William F. Shutler, Norton J. Tomassetti | 2002-10-22 |
| 6444562 | Nickel alloy films for reduced intermetallic formation in solder | Pedro A. Chalco | 2002-09-03 |