Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6491205 | Assembly of multi-chip modules using eutectic solders | Chon Cheong Lei, Jac A. Burke, N. James Tomassetti, Lawrence A. Thomas, Tak-kwong Ng +1 more | 2002-12-10 |
| 6469375 | High bandwidth 3D memory packaging technique | Edmund Blackshear, Michael J. Ellsworth, Jr., William F. Shutler, Norton J. Tomassetti | 2002-10-22 |