Issued Patents 2002
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6490874 | Recuperative environmental conditioning unit | Richard C. Chu, Robert E. Simons | 2002-12-10 |
| 6489551 | Electronic module with integrated thermoelectric cooling assembly | Richard C. Chu, Robert E. Simons | 2002-12-03 |
| 6469375 | High bandwidth 3D memory packaging technique | William F. Beausoleil, Edmund Blackshear, William F. Shutler, Norton J. Tomassetti | 2002-10-22 |
| 6462271 | Capping structure for electronics package undergoing compressive socket actuation | Jeffrey T. Coffin, Lewis S. Goldmann, John G. Torok | 2002-10-08 |
| 6431260 | Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof | Dereje Agonafer, Richard C. Chu, Robert E. Simons | 2002-08-13 |
| 6424533 | Thermoelectric-enhanced heat spreader for heat generating component of an electronic device | Richard C. Chu, Robert E. Simons | 2002-07-23 |
| 6397618 | Cooling system with auxiliary thermal buffer unit for cooling an electronics module | Richard C. Chu, Robert E. Simons | 2002-06-04 |
| 6396700 | Thermal spreader and interface assembly for heat generating component of an electronic device | Richard C. Chu, Robert E. Simons | 2002-05-28 |
| 6366462 | Electronic module with integral refrigerant evaporator assembly and control system therefore | Richard C. Chu, Robert E. Simons | 2002-04-02 |
| 6337794 | Isothermal heat sink with tiered cooling channels | Dereje Agonafer, Richard C. Chu, Robert E. Simons | 2002-01-08 |