Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429388 | High density column grid array connections and method thereof | Mario J. Interrante, Brenda Peterson, William E. Sablinski, Amit K. Sarkhel | 2002-08-06 |
| 6395991 | Column grid array substrate attachment with heat sink stress relief | Robert Charles Dockerty, Ronald Maurice Fraga, Ciro Neal Ramirez, Gordon J. Robbins | 2002-05-28 |
| 6360938 | Process and apparatus to remove closely spaced chips on a multi-chip module | Stephen A. DeLaurentis, Mario J. Interrante, Raymond A. Jackson, John U. Knickerbocker, Kathleen A. Stalter | 2002-03-26 |
| 6350625 | Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereof | Mitchell S. Cohen, William K. Hogan, James L. Speidell, S. Jay Chey, Steven A. Cordes | 2002-02-26 |
| 6335210 | Baseplate for chip burn-in and/of testing, and method thereof | Mukta S. Farooq, Raymond A. Jackson, Sarah H. Knickerbocker | 2002-01-01 |