Issued Patents 2002
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6496356 | Multilayer capacitance structure and circuit board containing the same and method of forming the same | John M. Lauffer, Konstantinos I. Papathomas | 2002-12-17 |
| 6459047 | Laminate circuit structure and method of fabricating | Voya R. Markovich, Konstantinos I. Papathomas | 2002-10-01 |
| 6429384 | Chip C4 assembly improvement using magnetic force and adhesive | Francis J. Downes, Jr., Mark V. Pierson | 2002-08-06 |
| 6426470 | Formation of multisegmented plated through holes | Donald S. Farquhar, John M. Lauffer, Konstantinos I. Papathomas | 2002-07-30 |
| 6399896 | Circuit package having low modulus, conformal mounting pads | Frank J. Downes, Jr., Donald S. Farquhar, William J. Rudik | 2002-06-04 |
| 6387830 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, William J. Rudik, John Frank Surowka | 2002-05-14 |
| 6387205 | Dustfree prepreg and method for making an article based thereon | Bernd Karl Appelt, William Thomas Fotorny, Kostantinos Papathomas, Mark D. Poliks | 2002-05-14 |
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Gerald W. Jones, John S. Kresge +3 more | 2002-04-16 |
| 6355364 | Process of heat treating and annealing CIC and CIC created thereby | Lisa J. Jimarez, Bonnie McClure | 2002-03-12 |
| 6351030 | Electronic package utilizing protective coating | Ross Downey Havens, Jeffrey Alan Knight, Mark D. Poliks, Anne Marie Quinn | 2002-02-26 |
| 6343001 | Multilayer capacitance structure and circuit board containing the same | John M. Lauffer, Konstantinos I. Papathomas | 2002-01-29 |