Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Donald S. Farquhar, Robert M. Japp, Gerald W. Jones, John S. Kresge +3 more | 2002-04-16 |
| 6335495 | Patterning a layered chrome-copper structure disposed on a dielectric substrate | Donald S. Farquhar, Edmond O. Fey, Michael Joseph Klodowski | 2002-01-01 |