Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429384 | Chip C4 assembly improvement using magnetic force and adhesive | Robert M. Japp, Mark V. Pierson | 2002-08-06 |
| 6373717 | Electronic package with high density interconnect layer | Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones, John S. Kresge +3 more | 2002-04-16 |
| 6348737 | Metallic interlocking structure | Gerald G. Advocate, Jr., Luis J. Matienzo, Ronald A. Kaschak, John S. Kresge, Daniel C. Van Hart | 2002-02-19 |