Issued Patents 2002
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501171 | Flip chip package with improved cap design and process for making thereof | David E. Houser, Konstantinos I. Papathomas | 2002-12-31 |
| 6465084 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Konstantinos I. Papathomas, Mark D. Poliks | 2002-10-15 |
| 6429527 | Method and article for filling apertures in a high performance electronic substrate | Konstantinos I. Papathomas | 2002-08-06 |
| 6426470 | Formation of multisegmented plated through holes | Robert M. Japp, John M. Lauffer, Konstantinos I. Papathomas | 2002-07-30 |
| 6407461 | Injection molded integrated circuit chip assembly | Konstantinos I. Papathomas | 2002-06-18 |
| 6399896 | Circuit package having low modulus, conformal mounting pads | Frank J. Downes, Jr., Robert M. Japp, William J. Rudik | 2002-06-04 |
| 6395998 | Electronic package having an adhesive retaining cavity | Gregory Kevern, Michael Joseph Klodowski | 2002-05-28 |
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Elizabeth Foster, Robert M. Japp, Gerald W. Jones, John S. Kresge +3 more | 2002-04-16 |
| 6369449 | Method and apparatus for injection molded flip chip encapsulation | Michael Joseph Klodowski, Kostantinos Papathomas, James R. Wilcox | 2002-04-09 |
| 6335495 | Patterning a layered chrome-copper structure disposed on a dielectric substrate | Edmond O. Fey, Elizabeth Foster, Michael Joseph Klodowski | 2002-01-01 |