Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6427323 | Method for producing conductor interconnect with dendrites | Bernd Karl Appelt, Saswati Datta, Michael A. Gaynes, John M. Lauffer | 2002-08-06 |
| 6410988 | Thermally enhanced and mechanically balanced flip chip package and method of forming | David V. Caletka, Jean Dery, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson +1 more | 2002-06-25 |
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones +3 more | 2002-04-16 |
| 6369449 | Method and apparatus for injection molded flip chip encapsulation | Donald S. Farquhar, Michael Joseph Klodowski, Kostantinos Papathomas | 2002-04-09 |
| 6351393 | Electronic package for electronic components and method of making same | John S. Kresge, Robert David Sebesta, David B. Stone | 2002-02-26 |