Issued Patents 2002
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495771 | Compliant multi-layered circuit board for PBGA applications | Eric A. Johnson | 2002-12-17 |
| 6492724 | Structure for reinforcing a semiconductor device to prevent cracking | Mark V. Pierson, Aleksander Zubelewicz | 2002-12-10 |
| 6487461 | TFT panel alignment and attachment method and apparatus | Allan O. Johnson, Ramesh R. Kodnani, Mark V. Pierson, Edward J. Tasillo | 2002-11-26 |
| 6447885 | Bonding together surfaces | Ramesh R. Kodnani | 2002-09-10 |
| 6432511 | Thermoplastic adhesive preform for heat sink attachment | John G. Davis, Joseph D. Poole | 2002-08-13 |
| 6427323 | Method for producing conductor interconnect with dendrites | Bernd Karl Appelt, Saswati Datta, John M. Lauffer, James R. Wilcox | 2002-08-06 |
| 6410988 | Thermally enhanced and mechanically balanced flip chip package and method of forming | David V. Caletka, Jean Dery, Eric Duchesne, Eric A. Johnson, Luis J. Matienzo +1 more | 2002-06-25 |
| 6403882 | Protective cover plate for flip chip assembly backside | William T. Chen, Eric A. Johnson, Tien Y. Wu | 2002-06-11 |
| 6369452 | Cap attach surface modification for improved adhesion | Stephen L. Buchwalter, Hung Manh Dang, Konstantinos I. Papathomas | 2002-04-09 |
| 6344099 | TFT panel alignment and attachment method and apparatus | Allan O. Johnson, Ramesh R. Kodnani, Mark V. Pierson, Edward J. Tasillo | 2002-02-05 |