Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6410988 | Thermally enhanced and mechanically balanced flip chip package and method of forming | David V. Caletka, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson, Luis J. Matienzo +1 more | 2002-06-25 |
| 6348738 | Flip chip assembly | Frank D. Egitto, Luis J. Matienzo, Charles Ouellet, Luc Ouellet, David L. Questad +2 more | 2002-02-19 |