Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6447914 | Method of uniformly depositing seed and a conductor and the resultant printed circuit structure | Anastasios Angelopoulos, Gerald W. Jones, Thomas R. Miller, William D. Taylor | 2002-09-10 |
| 6420253 | Method for preventing adhesive bleed onto surfaces | Bernd Karl Appelt, Gary Johansson, Gerald W. Jones, Yenloan H. Nguyen, Konstantinos I. Papathomas | 2002-07-16 |
| 6410988 | Thermally enhanced and mechanically balanced flip chip package and method of forming | David V. Caletka, Jean Dery, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson +1 more | 2002-06-25 |
| 6348737 | Metallic interlocking structure | Gerald G. Advocate, Jr., Francis J. Downes, Jr., Ronald A. Kaschak, John S. Kresge, Daniel C. Van Hart | 2002-02-19 |
| 6348738 | Flip chip assembly | Jean Dery, Frank D. Egitto, Charles Ouellet, Luc Ouellet, David L. Questad +2 more | 2002-02-19 |
| 6337004 | High adhesion performance roll sputtered strike layer | Kim J. Blackwell, Pei C. Chen, Frank D. Egitto, Allan R. Knoll, George J. Matarese | 2002-01-08 |