Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6447914 | Method of uniformly depositing seed and a conductor and the resultant printed circuit structure | Anastasios Angelopoulos, Luis J. Matienzo, Thomas R. Miller, William D. Taylor | 2002-09-10 |
| 6420253 | Method for preventing adhesive bleed onto surfaces | Bernd Karl Appelt, Gary Johansson, Luis J. Matienzo, Yenloan H. Nguyen, Konstantinos I. Papathomas | 2002-07-16 |
| 6376158 | Methods for selectively filling apertures | Heike Marcello, Kostas Papathomas | 2002-04-23 |
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, John S. Kresge +3 more | 2002-04-16 |