Issued Patents 2002
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501171 | Flip chip package with improved cap design and process for making thereof | Donald S. Farquhar, David E. Houser | 2002-12-31 |
| 6496356 | Multilayer capacitance structure and circuit board containing the same and method of forming the same | Robert M. Japp, John M. Lauffer | 2002-12-17 |
| 6479093 | Composite laminate circuit structure and methods of interconnecting the same | John M. Lauffer, Voya R. Markovich, Thomas R. Miller, William E. Wilson | 2002-11-12 |
| 6465084 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Donald S. Farquhar, Mark D. Poliks | 2002-10-15 |
| 6459047 | Laminate circuit structure and method of fabricating | Robert M. Japp, Voya R. Markovich | 2002-10-01 |
| 6455139 | Process for reducing extraneous metal plating | John J. Konrad, Timothy L. Wells, James Warren Wilson | 2002-09-24 |
| 6452117 | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes | Brian E. Curcio, Peter A. Gruber, Frederic Maurer, Mark D. Poliks | 2002-09-17 |
| RE37840 | Method of preparing a printed circuit board | Anilkumar C. Bhatt, Roy H. Magnuson, Voya R. Markovich, Douglas O. Powell | 2002-09-17 |
| 6444407 | Plate for liquid crystal display, method and polymeric compositions | Richard A. Day, Ramesh R. Kodnani | 2002-09-03 |
| 6432182 | Treatment solution for reducing adhesive resin bleed | John J. Konrad, John A. Welsh | 2002-08-13 |
| 6427325 | Flowable compositions and use in filling vias and plated through-holes | Gary Johansson | 2002-08-06 |
| 6429527 | Method and article for filling apertures in a high performance electronic substrate | Donald S. Farquhar | 2002-08-06 |
| 6426470 | Formation of multisegmented plated through holes | Donald S. Farquhar, Robert M. Japp, John M. Lauffer | 2002-07-30 |
| 6420253 | Method for preventing adhesive bleed onto surfaces | Bernd Karl Appelt, Gary Johansson, Gerald W. Jones, Luis J. Matienzo, Yenloan H. Nguyen | 2002-07-16 |
| 6407461 | Injection molded integrated circuit chip assembly | Donald S. Farquhar | 2002-06-18 |
| 6388204 | Composite laminate circuit structure and methods of interconnecting the same | John M. Lauffer, Voya R. Markovich, Thomas R. Miller, William E. Wilson | 2002-05-14 |
| 6369452 | Cap attach surface modification for improved adhesion | Stephen L. Buchwalter, Hung Manh Dang, Michael A. Gaynes | 2002-04-09 |
| 6343001 | Multilayer capacitance structure and circuit board containing the same | Robert M. Japp, John M. Lauffer | 2002-01-29 |
| 6337375 | High optical contrast resin composition and electronic package utilizing same | Gary Johansson | 2002-01-08 |