Issued Patents 2002
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6461136 | Apparatus for filling high aspect ratio via holes in electronic substrates | Frederic Maurer, Lubomyr T. Romankiw | 2002-10-08 |
| 6452117 | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes | Brian E. Curcio, Frederic Maurer, Konstantinos I. Papathomas, Mark D. Poliks | 2002-09-17 |
| 6425518 | Method and apparatus for applying solder to an element on a substrate | Chon Cheong Lei | 2002-07-30 |
| 6426241 | Method for forming three-dimensional circuitization and circuits formed | Steven A. Cordes, James L. Speidell, Wayne J. Howell, Thomas G. Ference | 2002-07-30 |
| 6394334 | Method and apparatus for forming solder bumps | Guy Paul Brouillette, Frederic Maurer | 2002-05-28 |
| 6390439 | Hybrid molds for molten solder screening process | Steven A. Cordes, David Danovitch, James L. Speidell, Joseph Zinter | 2002-05-21 |
| 6362557 | Ultrasonic method and actuator for inducing motion of an object | Frederic Maurer, George F. Walker | 2002-03-26 |
| 6341418 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, David Danovitch, Michael Liehr, Carlos J. Sambucetti | 2002-01-29 |
| 6340630 | Method for making interconnect for low temperature chip attachment | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Bruce Lee Humphrey, Michael Liehr +2 more | 2002-01-22 |