ML

Michael Liehr

IBM: 2 patents #982 of 5,400Top 20%
Fraunhofer: 1 patents #26 of 180Top 15%
UG Unaxis Deutschland Gmbh: 1 patents #1 of 7Top 15%
LG Leybold Gmbh: 1 patents #5 of 18Top 30%
📍 Heitersheim, NY: #1 of 1 inventorsTop 100%
Overall (2002): #13,589 of 266,432Top 6%
4
Patents 2002

Issued Patents 2002

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6487986 Device for the plasma deposition of a polycrystalline diamond Lothar Schäfer 2002-12-03
6416292 Method for transporting at least one vaporous substance through the wall of a vacuum chamber and into the vacuum chamber and a device for executing and utilizing the method 2002-07-09
6341418 Method for direct chip attach by solder bumps and an underfill layer Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Carlos J. Sambucetti 2002-01-29
6340630 Method for making interconnect for low temperature chip attachment Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey +2 more 2002-01-22