Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6394334 | Method and apparatus for forming solder bumps | Peter A. Gruber, Frederic Maurer | 2002-05-28 |
| 6341418 | Method for direct chip attach by solder bumps and an underfill layer | David Danovitch, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti | 2002-01-29 |
| 6340630 | Method for making interconnect for low temperature chip attachment | Daniel G. Berger, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more | 2002-01-22 |