Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6390439 | Hybrid molds for molten solder screening process | Steven A. Cordes, Peter A. Gruber, James L. Speidell, Joseph Zinter | 2002-05-21 |
| 6341418 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti | 2002-01-29 |
| 6340630 | Method for making interconnect for low temperature chip attachment | Daniel G. Berger, Guy Paul Brouillette, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more | 2002-01-22 |