Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6455778 | Micro-flex technology in semiconductor packages | Claude L. Bertin, Thomas G. Ference, John A. Fifield | 2002-09-24 |
| 6444490 | Micro-flex technology in semiconductor packages | Claude L. Bertin, Thomas G. Ference, John A. Fifield | 2002-09-03 |
| 6426241 | Method for forming three-dimensional circuitization and circuits formed | Steven A. Cordes, Peter A. Gruber, James L. Speidell, Thomas G. Ference | 2002-07-30 |
| 6426904 | Structures for wafer level test and burn-in | John E. Barth, Jr., Claude L. Bertin, Jeffrey H. Dreibelbis, Wayne F. Ellis, Erik L. Hedberg +3 more | 2002-07-30 |
| 6410431 | Through-chip conductors for low inductance chip-to-chip integration and off-chip connections | Claude L. Bertin, William R. Tonti, Jerzy M. Zalesinski | 2002-06-25 |
| 6358627 | Rolling ball connector | Joseph A. Benenati, Claude L. Bertin, William T. Chen, Thomas Edward Dinan, Wayne F. Ellis +4 more | 2002-03-19 |