Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501171 | Flip chip package with improved cap design and process for making thereof | Donald S. Farquhar, Konstantinos I. Papathomas | 2002-12-31 |
| 6483046 | Circuit board having burr free castellated plated through holes | James M. Larnerd, Jeffrey L. Lee, Francis S. Poch | 2002-11-19 |
| 6453549 | Method of filling plated through holes | Anilkumar C. Bhatt, John A. Welsh | 2002-09-24 |