Issued Patents 2002
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6495771 | Compliant multi-layered circuit board for PBGA applications | Michael A. Gaynes | 2002-12-17 |
| 6490161 | Peripheral land grid array package with improved thermal performance | — | 2002-12-03 |
| 6486554 | Molded body for PBGA and chip-scale packages | — | 2002-11-26 |
| 6444209 | Hybrid botulinal neurotoxins | Michael C. Goodnough, Marite Bradshaw, William H. Tepp | 2002-09-03 |
| 6410988 | Thermally enhanced and mechanically balanced flip chip package and method of forming | David V. Caletka, Jean Dery, Eric Duchesne, Michael A. Gaynes, Luis J. Matienzo +1 more | 2002-06-25 |
| 6403882 | Protective cover plate for flip chip assembly backside | William T. Chen, Michael A. Gaynes, Tien Y. Wu | 2002-06-11 |
| 6373703 | Integral design features for heatsink attach for electronic packages | Stephen J. Kosteva, Stephen W. MacQuarrie | 2002-04-16 |
| 6341071 | Stress relieved ball grid array package | John S. Kresge | 2002-01-22 |