Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492724 | Structure for reinforcing a semiconductor device to prevent cracking | Michael A. Gaynes, Mark V. Pierson | 2002-12-10 |
| 6488806 | Assembly process for flip chip package having a low stress chip and resulting structure | Timothy F. Carden | 2002-12-03 |
| 6347901 | Solder interconnect techniques | Seungbae Park, Sanjeev Sathe | 2002-02-19 |