TC

Timothy F. Carden

IBM: 1 patents #1,916 of 5,400Top 40%
📍 Vestal, NY: #25 of 64 inventorsTop 40%
🗺 New York: #3,002 of 9,277 inventorsTop 35%
Overall (2002): #102,323 of 266,432Top 40%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6488806 Assembly process for flip chip package having a low stress chip and resulting structure Aleksander Zubelewicz 2002-12-03